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材料科学
Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique
Silicon/aluminum(Si/Al) composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites with lowered coefficient of thermal expansion(CTE) and high thermal conductivity were produced by powder metallurgy(PM).The Si/Al composites are fully dense and have fine Si particles uniquely distributed within pure Al matrix.Three 50%Si/Al composites were designed to have strength in the range of 185-290 MPa to meet different demands,while the other properties keep invariable.Fracture toughness of the composites is measured to be 9-10 MPa·m~(1/2).The composites were machined to 50%Si/Al housings and 27%Si/Al lids.Both the hermeticities of housings before and after laser-beam-welding sealing are determined.The measured leak rate of composites and sealed housings is in magnitude order of 1×10~(-10) and 1×10~(-9) Pa·m~3·s~(-1),respectively,suggesting high hermeticity.The good hermeticity is attributed to the full dense materials,good weldability,and extremely low weld porosity.The present Si/Al composites are expected to be extensively used in highly hermetic electronic packages.
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Rare Metals
2020年11期

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