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金属学及金属工艺
Microjoining for Medical,Microelectronic and MEMS Applications
<正> This paper will review recent advances and current challenges in microjoining technology in selected areas, such as bonding mechanism studies, process development and optimization, process sensing and monitoring, dissimilar material combinations, part positioning and fixturing, machine accuracy, etc. A number of examples will be provided of both practical applications and R&D activities. For example, case studies will be outlined of microjoining applications in microelectronic packaging, implantable cardiac pacemaker interconnection and hermetic sealing, and radioactive seed implant encapsulation for prostate cancer treatment. Examples of current R&D will include in-situ monitoring in wire bonding using integrated microsensors, bonding mechanism studies in resistance cross-wire bonding, developments in fluxless soldering by plasma, and laser-ultrasonic bonding. Finally, discussions will be offered about future developments, especially in the areas of MEMS packaging, and nanojoining - the next frontier for materials joining technology.
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第十一次全国焊接会议论文集(第1册)
2005年

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