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Ag-nanoparticle Catalyst for Electroless Cu Deposition and Its Adsorption onto Epoxy Substrate

Y.Fujiwara;Y. Kobayashi;K. Kita;M. Noro;J. Katayama;K. Otsuka

  Introduction Electroless Cu plating on polymer substrate is the key process in the PWB manufacturing. Pd/Sn catalysts are usually used to initiate the electroless deposition. As a more inexpensive alternative, Ag nanoparticles can be used to start electroless Cu plating[1].In this paper, we show the preparation of Ag-nanoparticle catalyst and the enhancement of their adsoprtion onto the epoxy substrate by predipping into cationic surfactant solutions.……   
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