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Decomposition of Poly (Amide-imide) Film Enameled on Solid Copper Wire by ATMOSPHERIC Pressure Non-Equilibrium Plasma

Kazuo Sugiyama;Katsunori Suzuki;Yosuke Aoki;Shusuke Kuwasima;Hideki Kurokawa;Hiroshi Miura

  In our experiment,when various oxide powders were prepared by microwave heating under argon gas flow,we found that atmospheric pressure non-equilibrium plasma generates around some powders.This phenomenon was peculiar to electrically conductive and heat-resistive materials such as perovskite-type oxide,silicon carbide and silicon.These plasmas could also be generated easily using gas mixtures consisting of argon and additive gases.With an eye towards industrial applications,we tried to modify the surface of substratcs as application examples. In this study,we have attempted the decorrrposition of poly(amide-imide)film enameled on solid copper wire using the atmospheric pressure plasma.Poly(amide-imide)exhibits exceptional physical and chemical properties such as higher resistance to heat,abrasion and refrigerants.It is difficult that the poly(amide-imide)film is stripped off from the copper surface by usual mechanical or thermal treatment.We thought that the plasma-treatment was effective,The plasma was produced by applying microwave power to silicon under a gas mixture of argon,oxygen,and hydrogen.The poly(amide-imide)thin film could be easily decomposed by argon-oxygen mixed gas plasma and the oxidized surface of the copper substrate was obtained.The heat-treatment of the oxidized sample using argon-hydrogen mixed gas plasma yielded the reduced surface of the metallic copper.We would like to propose that our plasma decomposition process of the poly(amidc-imidc) coating film on the enameled wire is suitable for the new soldering process.……   
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