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The Plasma Technology for Fine Pattern PCB

T;I.BAEK

  The trace density of PCBs is usually two orders lower than typical semiconductor ICs such as DRAM. While the semiconductor companies were considering sub-micron lines in the late 1980s, PCB manufacturers were still developing 100-micron lines and spaces. Nowadays, the semiconductor device manufacturers are talking about 90 nanometer lines (0.09 micron) as their next generation design rules, but there has been remarkable……   
[关键词]:The Plasma Technology for Fine Pattern PCB
[文献类型]:会议论文
[文献出处]: 《2006年上海电子电镀学术报告会资料汇编2006年
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